The MPI TS50 manual probe system is designed for DCCV and RF measurement applications in integrated circuit engineering, single-mode probes, and academic use. The TS50 occupies a small space (300 x 300 millimeters) and is designed in the simplest form, making it easy to operate, providing quick settings, and not compromising functionality and measurement capabilities.

2、 Function

1. Easy stage

TS50 can be configured with two different versions of chuck level control. Easy Stage is a very simple vacuum controlled one handed operation device that enables fast and intuitive XY Theta movements. This is a typical configuration for simple DC/CV applications.

2. Linear 50x50mm XY platform

The linear 50x50mm XY platform enables fast independent axis movement and features additional fine and precise 25x25mm XY Theta micrometer positioning. RF must be selected or used in conjunction with a hot card tray.

3. Height adjustment scale

The probe pressure plate has a fine height adjustment of 20 mm to support various applications. And it can be used for contact/separation control of all MicroPositioners.

4. Three axis clamp

For RF applications, the TS50's 50mm three-axis chuck is equipped with an auxiliary chuck with built-in ceramic material for precise RF calibration.

5. Rectangular adjustment of MicroPositioners

In addition, the rectangular adjustment of the two port RF MicroPositioners is a standard feature to ensure alignment between RF probes.

6. Multiple configurations of MicroPositioners

It can be configured with up to 8 MPI MP25 or 6 MPI MP40 micro locators to meet various pad and device layout requirements.

7. Various optical options

Various optical components are available for selection, suitable for all common DC/CV applications, as well as single tube high magnification microscopes for RF or load pull configurations.

8. IC bracket

The optional single IC bracket converts the TS50 into an ideal platform for single DUT testing as low as 1x1mm. It includes a stable and convenient vacuum switch that can correctly fix chip sizes up to 10x10mm. Integrating a calibration substrate bracket at a parallel height allows for RF measurement and can be installed on any chuck, including various thermal chucks.